Reactive Ion Etching of Silicon using F-based chemistry - Exploring the Limits
Dry Etching is widely used in nanoprocessing as a method of pattern transfer onto a hard substrate, like silicon. Improving the resolution of this etch process is an important step in reducing the feature size in, for instance, computer microchips, or Nanoimprint Lithography stamps. TheReactiveIonEtcheratLundUniversityhasrecentlybeenupgradedwithaturbo molecular pump. This allows for lower pressure