Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling
With the increasing output power of the integrated circuit chips, the heat flux involved is being accordingly increased. In such situation, the air has almost reached its limit of cooling capacity, and thus the liquid cooling technology incorporating microchannel heat sinks is desired to cool the electronic chips in order to remove more heat loads. However, these microchannel heat sinks are often