Design Space Exploration and PPA Evaluation of ARM NI-700 Interconnect as a Replacement for NIC-400 in ASIC Architectures
With the rapid evolution of semiconductor technology and the growing demand for high-performance, low-power System-on-Chip solutions, the design of efficient and scalable on-chip interconnect architectures has become a critical challenge in modern ASIC development. This thesis focuses on design space exploration of replacing multiple ARM CoreLink NIC-400 crossbar-based interconnects with a unified
