Polymer-based Cu/Ag composite as seed layer on insulating substrate for copper addition of multi-dimensional conductive patterns
Conductive polymer direct electroplating technology is one of the research hotspots in printed circuit board manufacturing. In this work, we designed a simple, efficient and environmental friendly chemical polymerization method to form a conductive polymer-based metal-mixed composite film where the polymer was polythiophene and the metals included copper and silver (PT-based Cu/Ag composite film).