Heat transfer correlations for jet impingement boiling over micro-pin-finned surface
Heat transfer performance of submerged jet impingement boiling over staggered micro-pin-finned surfaces was investigated using air-dissolved FC-72. The dimension of the silicon chips is 10 × 10 × 0.5 mm3 (length × width × thickness) on staggered micro-pin-fins with four dimensions of 30 × 30 × 60 μm3, 50 × 50 × 60 μm3, 30 × 30 × 120 μm3 and 50 × 50 × 120 μm3 (width × thickness × height, named S-PF