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In this paper we have proposed a test cost model for core-based 3D Stacked ICs (SICs) connected by Through Silicon Vias (TSVs). Unlike in the case of non-stacked chips, where the test flow is well defined by applying the same test schedule both at wafer sort and at package test, the most cost-efficient test flow for 3D TSV-SICs is yet undefined. Therefore, analysing the various alternatives of tes
Modern safe and high-quality products not only need to have desired properties in terms of geometry, material, features, etc. from a position-interaction point of view. Also compliance, deflection, impact and safety features depending on force-interacting properties are of (increasing) importance. As a key such example, the mechanical response of car seats has been studied, including the contact f
The importance of prioritising requirements is widely recognised. A number of different techniques for prioritising requirements have been proposed, some based on an ordinal scale, others on a ratio scale. Different scales provide different levels of information, e.g. the ratio scale is richer than the ordinal scale. This paper aims to investigate the difference in information and aim to find ways
The main goal of this paper is to establish general constitutive relations for the electromagnetic fields E,D,B and H in a time domain setting. The four basic assumptions of the medium are linearity, invariance to time translations, causality and continuity. These four assumptions imply that the constitutive relations are convolutions of Riemann-Stieltjes type. A review of the classifi- cation of
