3D Topological Insulator-Based Eutectic Heterostructures : Fabrication and Potential Applications
We report the fabrication of three-dimensional topological insulator heterostructures using a single-step bottom-up approach based on directional solidification. These materials exhibit atomically smooth interfaces, preserving topological surface states and enabling hetero-junction formation. This scalable approach paves the way for advancements in spintronics, quantum computing, and novel optoele
