Long term evolution of microstructure and stress around tin whiskers investigated using scanning Laue microdiffraction
Scanning Laue microdiffraction was used to study the evolution of the microstructure and the stress field around two tin whiskers during ageing for up to 21 months. In the heterogeneous stress fields obtained, localised ridges of high compressive stress leading to the root of the whiskers were found. Due to the evolution of the intermetallic compound in the interface between the copper substrate a
