Radio frequency reliability studies of CMOS RF integrated circuits for ultra-thin flexible packages
This Letter presents for the first time radio frequency (RF) reliability studies of fully integrated CMOS RF integrated circuits (RFICs) for next generation wireless communication applications involving conformal bodies where wireless communication RFICs will be embedded on ultra-thin flexible packages. As a test case, RF characteristics of a CMOS voltage-controlled oscillator (VCO) chip with mult