In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate
Metal particles are embedded in the polymer to form a polymer composite film as a seed layer on an insulating substrate to overcome the limitation that electrodeposited copper only occurring at the interface between the polymer and the metal electrode. In this work, we successfully developed a Cu-polythiophenes composite film (Cu-PT composite film) through a facile in-situ reduction method, obtain