Sintering of binderless cubic boron nitride and its modification by β-Si3N4 additive for hard machining applications
This study present the results of HP-HT sintering, microstructure, properties, and performance of binderless cBN tool material. Within the investigated sintering temperature range of 1900–2600 °C the optimum was found to be 2200–2300 °C. Lower temperature results in incomplete diffusion bonding between cBN grains, while higher temperature results in high degree of recrystallization of initial stru